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DESCRIPTION
SPECIFICATIONS
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DESCRIPTION
The Thermal Paste is offered as an accessory to several Wavelength Electronics product lines to help ensure adequate thermal control during operation.
It is non-silicone. Comprised of a poly-synthetic fluid and metal oxide components, it spreads easily for excellent surface coverage and thermal conductivity of up to 3.0 W / °C.
Thermal paste should be applied thinly and evenly across the mounting area. Refer to the individual product datasheet to determine the best location for thermal paste application.
Free, effective, and responsive technical support is available to simplify integration of Wavelength products into your OEM design. Standard product can be easily modified to meet your application requirements.
SPECIFICATIONS
Thermal Conductivity: 0.7 to 3.0 W / °C, depending on thickness and evenness of application.
Coverage area: approximately 4″ by 6″ (100×150 mm)
Chemical Composition: Poly-synthetic fluid >20%, zinc oxide >60%
This product is stable with no known hazardous components. Hazardous polymerization will not occur.
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